Power chips are attached to external circuits with packaging, and their performance depends on the assistance of the product packaging. In high-power scenarios, power chips are typically packaged as power components. Chip affiliation refers to the electrical link on the upper surface area of the chip, which is typically aluminum bonding cord in typical components. ^
Standard power component package cross-section
Today, industrial silicon carbide power modules still mainly make use of the packaging modern technology of this wire-bonded traditional silicon IGBT module. They encounter issues such as big high-frequency parasitic criteria, not enough heat dissipation ability, low-temperature resistance, and insufficient insulation strength, which restrict using silicon carbide semiconductors. The screen of outstanding efficiency. In order to solve these problems and totally make use of the huge prospective benefits of silicon carbide chips, numerous brand-new product packaging modern technologies and remedies for silicon carbide power modules have actually emerged in recent years.
Silicon carbide power module bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually created from gold wire bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually developed from gold wires to copper wires, and the driving force is expense decrease; high-power devices have actually created from light weight aluminum wires (strips) to Cu Clips, and the driving pressure is to enhance item efficiency. The better the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that utilizes a solid copper bridge soldered to solder to connect chips and pins. Compared to conventional bonding product packaging methods, Cu Clip technology has the complying with advantages:
1. The connection in between the chip and the pins is made from copper sheets, which, to a certain extent, replaces the common cord bonding technique between the chip and the pins. As a result, a special package resistance value, higher current flow, and much better thermal conductivity can be acquired.
2. The lead pin welding area does not require to be silver-plated, which can fully conserve the cost of silver plating and bad silver plating.
3. The item look is entirely consistent with typical products and is mostly utilized in web servers, portable computers, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.
Cu Clip has two bonding methods.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding method is more pricey and intricate, however it can accomplish much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus wire bonding method
The source pad utilizes a Clip technique, and the Gate uses a Cord approach. This bonding approach is somewhat more affordable than the all-copper bonding technique, saving wafer location (suitable to extremely little entrance areas). The procedure is easier than the all-copper bonding technique and can acquire better Rdson and better thermal effect.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper brass, please feel free to contact us and send an inquiry.
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